Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831307 | Gap fill self planarization on post EPI | Po-Chang Chen, Ding-I Liu | 2017-11-28 |
| 9716044 | Interlayer dielectric structure with high aspect ratio process (HARP) | Jen-Chi Chang, Chun-Li Lin, Kai-Shiung Hsu, Ming-Shiou Kuo, Wen-Long Lee +1 more | 2017-07-25 |
| 9631273 | Apparatus for dielectric deposition process | Lan-Hai Wang, Ding-I Liu, Si-Wen Liao, Yong-Hung Yang | 2017-04-25 |
| 9607809 | High density plasma reactor with multiple top coils | Chi-Ching Lo, Tzu-Chun LIN, Ding-I Liu, Jen-Chi Chang, Ho-Ta Chuang | 2017-03-28 |
| 9573144 | Coating apparatus and method of forming coating film | Lan-Hai Wang, Yong-Hung Yang, Ding-I Liu, Si-Wen Liao, Mao-Cheng Lin | 2017-02-21 |
| 9536771 | Gap fill self planarization on post EPI | Po-Chang Chen, Ding-I Liu | 2017-01-03 |