Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711372 | Double patterning method | Chia-Ying Lee | 2017-07-18 |
| 9627250 | Method and apparatus for back end of line semiconductor device processing | Chung-Wen Wu, Chih-Yuan Ting | 2017-04-18 |
| 9613903 | Fine line space resolution lithography structure for integrated circuit features using double patterning technology | Chia-Ying Lee | 2017-04-04 |
| 9601348 | Interconnect structure and method of forming same | Ming-Hui Chu, Chih-Yuan Ting | 2017-03-21 |
| 9601344 | Method of forming pattern for semiconductor device | Chia-Ying Lee, Chih-Yuan Ting, Ming-Hsing Tsai, Syun-Ming Jang | 2017-03-21 |
| 9570341 | Semiconductor device having air gap structures and method of fabricating thereof | Chih-Yuan Ting | 2017-02-14 |
| 9564327 | Method for forming line end space structure using trimmed photo resist | Chia-Ying Lee, Ming-Feng Shieh, Shih-Ming Chang, Chih-Ming Lai, Ken-Hsien Hsieh +1 more | 2017-02-07 |