Issued Patents 2017
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818643 | Semiconductor interconnect structure and manufacturing method thereof | — | 2017-11-14 |
| 9666534 | Semiconductor interconnect structure and manufacturing method thereof | — | 2017-05-30 |
| 9640435 | Patterning approach for improved via landing profile | Chung-Wen Wu | 2017-05-02 |
| 9627250 | Method and apparatus for back end of line semiconductor device processing | Chung-Wen Wu, Jyu-Horng Shieh | 2017-04-18 |
| 9601348 | Interconnect structure and method of forming same | Ming-Hui Chu, Jyu-Horng Shieh | 2017-03-21 |
| 9601344 | Method of forming pattern for semiconductor device | Chia-Ying Lee, Jyu-Horng Shieh, Ming-Hsing Tsai, Syun-Ming Jang | 2017-03-21 |
| 9583384 | Via corner engineering in trench-first dual damascene process | — | 2017-02-28 |
| 9570341 | Semiconductor device having air gap structures and method of fabricating thereof | Jyu-Horng Shieh | 2017-02-14 |
| 9564355 | Interconnect structure for semiconductor devices | — | 2017-02-07 |