Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9633900 | Method for through silicon via structure | Chen-Hua Yu, Shin-Puu Jeng, Wen-Chih Chiou, Chen-Yu Tsai | 2017-04-25 |
FT
Fang Wen Tsai
Overall (2017): #425,645 of 506,227Top 85%
1
Patents 2017