Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9799589 | Integrated circuit packaging system with a grid array with a leadframe and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2017-10-24 |
| 9620480 | Integrated circuit packaging system with unplated leadframe and method of manufacture thereof | Garret Dimaculangan, Linda Pei Ee Chua, Byung Tai Do | 2017-04-11 |
| 9576873 | Integrated circuit packaging system with routable trace and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2017-02-21 |