Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9620480 | Integrated circuit packaging system with unplated leadframe and method of manufacture thereof | Linda Pei Ee Chua, Byung Tai Do, Arnel Senosa Trasporto | 2017-04-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9620480 | Integrated circuit packaging system with unplated leadframe and method of manufacture thereof | Linda Pei Ee Chua, Byung Tai Do, Arnel Senosa Trasporto | 2017-04-11 |