Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847285 | Semiconductor packages including heat spreaders and methods of manufacturing the same | Jong Hoon Kim, Han Jun Bae | 2017-12-19 |
| 9847322 | Semiconductor packages including through mold ball connectors and methods of manufacturing the same | Jong Hoon Kim, Yeon Seung Jung, Hyeong-Seok Choi | 2017-12-19 |
| 9837360 | Wafer level packages and electronics system including the same | Hyeong-Seok Choi, Jong Hoon Kim, Young Geun Yoo, Pil Soon BAE | 2017-12-05 |
| 9806015 | Semiconductor packages including through mold ball connectors on elevated pads and methods of manufacturing the same | Jong Hoon Kim, Han Jun Bae | 2017-10-31 |
| 9659910 | Manufacturing methods semiconductor packages including through mold connectors | Jong Hoon Kim, Young Geun Yoo, Hyeong-Seok Choi | 2017-05-23 |
| 9640473 | Semiconductor packages | Young Geun Yoo | 2017-05-02 |