Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847322 | Semiconductor packages including through mold ball connectors and methods of manufacturing the same | Ki Jun SUNG, Jong Hoon Kim, Yeon Seung Jung | 2017-12-19 |
| 9842822 | Semiconductor packages with socket plug interconnection structures | — | 2017-12-12 |
| 9837360 | Wafer level packages and electronics system including the same | Ki Jun SUNG, Jong Hoon Kim, Young Geun Yoo, Pil Soon BAE | 2017-12-05 |
| 9659910 | Manufacturing methods semiconductor packages including through mold connectors | Jong Hoon Kim, Ki Jun SUNG, Young Geun Yoo | 2017-05-23 |