Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847322 | Semiconductor packages including through mold ball connectors and methods of manufacturing the same | Ki Jun SUNG, Jong Hoon Kim, Hyeong-Seok Choi | 2017-12-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847322 | Semiconductor packages including through mold ball connectors and methods of manufacturing the same | Ki Jun SUNG, Jong Hoon Kim, Hyeong-Seok Choi | 2017-12-19 |