Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837360 | Wafer level packages and electronics system including the same | Hyeong-Seok Choi, Ki Jun SUNG, Jong Hoon Kim, Pil Soon BAE | 2017-12-05 |
| 9659910 | Manufacturing methods semiconductor packages including through mold connectors | Jong Hoon Kim, Ki Jun SUNG, Hyeong-Seok Choi | 2017-05-23 |
| 9640473 | Semiconductor packages | Ki Jun SUNG | 2017-05-02 |