Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9673140 | Package structure having a laminated release layer and method for fabricating the same | Chia-Cheng Chen, Ming-Chen Sun, Tzu-Chieh Shen, Shih-Chao Chiu, Wei-Chung Hsiao +1 more | 2017-06-06 |
| 9646921 | Semiconductor package and fabrication method thereof | Cheng-Chia Chiang, Lung-Yuan Wang, Shih-Hao Tung, Shu-Huei Huang | 2017-05-09 |