Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9698051 | Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packages | Byung-Iyul Park, Hyun-Soo Chung, Gil-Heyun Choi, Son-Kwan Hwang | 2017-07-04 |
| 9691685 | Semiconductor devices and methods of manufacturing the same, and semiconductor packages including the semiconductor devices | Kyu-Ha Lee, Hyung Jun Jeon, Jum-Yong Park, Byung-Lyul Park, Ji-Soon Park +1 more | 2017-06-27 |