Issued Patents 2017
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852965 | Semiconductor devices with through electrodes and methods of fabricating the same | Ho-Jin Lee, Kwangjin Moon, Jisoon Park, Jin Ho An | 2017-12-26 |
| 9847276 | Semiconductor devices having through-electrodes and methods for fabricating the same | Pil-Kyu Kang, Sunghee KANG, Taeseong Kim, Taeyeong Kim, Kwangjin Moon +6 more | 2017-12-19 |
| 9831164 | Semiconductor device and method of fabricating the same | Kwang-Jin Moon, Pil-Kyu Kang, Dae-Lok Bae, Gil-Heyun Choi, Dong-Chan Lim +1 more | 2017-11-28 |
| 9824973 | Integrated circuit devices having through-silicon via structures and methods of manufacturing the same | Ho-Jin Lee, Jin Ho An | 2017-11-21 |
| 9773660 | Wafer processing methods | Tae-Yeong Kim, Pil-Kyu Kang, Jin-Ho Park | 2017-09-26 |
| 9728490 | Semiconductor devices and methods of manufacturing the same | Ju-Il Choi, Hyo Ju Kim, Yeun-Sang Park, Atsushi Fujisaki, Kwang-Jin Moon | 2017-08-08 |
| 9691684 | Integrated circuit device including through-silicon via structure and decoupling capacitor and method of manufacturing the same | Jae-Hwa Park, Sung-Hee Kang, Kwang-Jin Moon, Suk-Chul Bang | 2017-06-27 |
| 9691685 | Semiconductor devices and methods of manufacturing the same, and semiconductor packages including the semiconductor devices | Kyu-Ha Lee, Hyung Jun Jeon, Jum-Yong Park, Ji-Soon Park, Jin Ho An +1 more | 2017-06-27 |
| 9679829 | Semiconductor devices and methods of fabricating the same | Kwangjin Moon, Sunghee KANG, Taeseong Kim, Yeun-Sang Park, Sukchul Bang | 2017-06-13 |
| 9673133 | Semiconductor devices having through-electrodes | Jae-Hwa Park, Kwangjin Moon, Sukchul Bang | 2017-06-06 |
| 9653430 | Semiconductor devices having stacked structures and methods for fabricating the same | Taeyeong Kim, Seokho Kim, Pil-Kyu Kang, Hyoju Kim, Jin Ho An +1 more | 2017-05-16 |
| 9653623 | Methods of manufacturing a semiconductor device | Yi Koan Hong, Yeun-Sang Park, Joo-Hee Jang | 2017-05-16 |
| 9583373 | Wafer carrier having cavity | Ho-Jin Lee, Pil-Kyu Kang, Taeyeong Kim, Kyu-Ha Lee, Gilheyun Choi | 2017-02-28 |
| 9570377 | Semiconductor devices having through electrodes capped with self-aligned protection layers | Jeonggi Jin, Jisoon Park, Sukchul Bang, Deokyoung Jung | 2017-02-14 |
| 9543200 | Methods for fabricating semiconductor devices having through electrodes | Kunsang Park, Sukyoung Kim, Jisoon Park, Ju-Il Choi, Gilheyun Choi | 2017-01-10 |
| 9543250 | Semiconductor devices including through-silicon via | Jin Ho An, Soyoung Lee, Gilheyun Choi | 2017-01-10 |