Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9691684 | Integrated circuit device including through-silicon via structure and decoupling capacitor and method of manufacturing the same | Jae-Hwa Park, Sung-Hee Kang, Kwang-Jin Moon, Byung-Lyul Park | 2017-06-27 |