Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9735090 | Integrated circuit devices having through-silicon vias and methods of manufacturing such devices | Ju-Il Choi, Atsushi Fujisaki, Byung-Iyul Park, Ji-Soon Park, Jeong-gi Jin | 2017-08-15 |
| 9653430 | Semiconductor devices having stacked structures and methods for fabricating the same | Taeyeong Kim, Byung-Lyul Park, Seokho Kim, Pil-Kyu Kang, Hyoju Kim +1 more | 2017-05-16 |
| 9653623 | Methods of manufacturing a semiconductor device | Yi Koan Hong, Yeun-Sang Park, Byung-Lyul Park | 2017-05-16 |