Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9735090 | Integrated circuit devices having through-silicon vias and methods of manufacturing such devices | Ju-Il Choi, Atsushi Fujisaki, Ji-Soon Park, Joo-Hee Jang, Jeong-gi Jin | 2017-08-15 |
| 9698051 | Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packages | Jin-ho Chun, Hyun-Soo Chung, Gil-Heyun Choi, Son-Kwan Hwang | 2017-07-04 |