Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9698051 | Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packages | Jin-ho Chun, Byung-Iyul Park, Gil-Heyun Choi, Son-Kwan Hwang | 2017-07-04 |