Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9583373 | Wafer carrier having cavity | Ho-Jin Lee, Pil-Kyu Kang, Taeyeong Kim, Byung-Lyul Park, Kyu-Ha Lee | 2017-02-28 |
| 9543200 | Methods for fabricating semiconductor devices having through electrodes | Kunsang Park, Sukyoung Kim, Jisoon Park, Ju-Il Choi, Byung-Lyul Park | 2017-01-10 |
| 9543250 | Semiconductor devices including through-silicon via | Jin Ho An, Byung-Lyul Park, Soyoung Lee | 2017-01-10 |