Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9679874 | Semiconductor package and semiconductor device including the same | Jin-Kwon Bae, Jae Choon Kim, Kyol Park, Chajea Jo | 2017-06-13 |
| 9671141 | Thermoelectric cooling packages and thermal management methods thereof | Jae Choon Kim, Jin-Kwon Bae, Eunseok Cho | 2017-06-06 |
| 9651431 | Semiconductor package and method of estimating surface temperature of semiconductor device including the same | Jae Choon Kim, Jin-Kwon Bae, Eunho JUNG | 2017-05-16 |
| 9606591 | Surface temperature management method of mobile device and memory thermal management method of multichip package | Heungkyu Kwon, Jae Choon Kim, Eunseok Cho | 2017-03-28 |
| 9583430 | Package-on-package device | Kyol Park, Yunhyeok Im, Eon Soo Jang | 2017-02-28 |