Issued Patents 2017
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9704815 | Package substrate and semiconductor package including the same | Mi-Na Choi, Young-Deuk Kim, Eon Soo Jang, Hee-Jung Hwang | 2017-07-11 |
| 9679874 | Semiconductor package and semiconductor device including the same | Jin-Kwon Bae, Jichul Kim, Kyol Park, Chajea Jo | 2017-06-13 |
| 9671141 | Thermoelectric cooling packages and thermal management methods thereof | Jichul Kim, Jin-Kwon Bae, Eunseok Cho | 2017-06-06 |
| 9653373 | Semiconductor package including heat spreader and method for manufacturing the same | Heejung Hwang, Eon Soo Jang | 2017-05-16 |
| 9651431 | Semiconductor package and method of estimating surface temperature of semiconductor device including the same | Jichul Kim, Jin-Kwon Bae, Eunho JUNG | 2017-05-16 |
| 9606591 | Surface temperature management method of mobile device and memory thermal management method of multichip package | Heungkyu Kwon, Eunseok Cho, Jichul Kim | 2017-03-28 |
| 9588577 | Electronic systems including heterogeneous multi-core processors and methods of operating same | Min Seon Ahn, Ki-Soo Yu, Chi Gwan Oh, Myung-Kyoon Yim | 2017-03-07 |
| 9589842 | Semiconductor package and method of fabricating the same | Inho Choi, Donghan Kim, Jikho Song, Mitsuo Umemoto | 2017-03-07 |