Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9671141 | Thermoelectric cooling packages and thermal management methods thereof | Jae Choon Kim, Jichul Kim, Jin-Kwon Bae | 2017-06-06 |
| 9606591 | Surface temperature management method of mobile device and memory thermal management method of multichip package | Heungkyu Kwon, Jae Choon Kim, Jichul Kim | 2017-03-28 |