Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842799 | Semiconductor packages including upper and lower packages and heat dissipation parts | — | 2017-12-12 |
| 9704815 | Package substrate and semiconductor package including the same | Mi-Na Choi, Young-Deuk Kim, Jae Choon Kim, Hee-Jung Hwang | 2017-07-11 |
| 9653373 | Semiconductor package including heat spreader and method for manufacturing the same | Jae Choon Kim, Heejung Hwang | 2017-05-16 |
| 9583430 | Package-on-package device | Kyol Park, Jichul Kim, Yunhyeok Im | 2017-02-28 |