Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711377 | Method of manufacturing semiconductor device | Hiromi Shigihara, Kei Yajima | 2017-07-18 |
| 9646901 | Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark area | Bunji Yasumura, Masanao Sato, Hiromi Abe | 2017-05-09 |