Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9824944 | Semiconductor device | Bunji Yasumura, Fumio Tsuchiya, Hisanori Ito, Takuji Ide, Naoki Kawanabe | 2017-11-21 |
| 9646901 | Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark area | Toshihiko Akiba, Bunji Yasumura, Hiromi Abe | 2017-05-09 |