Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9646901 | Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark area | Toshihiko Akiba, Bunji Yasumura, Masanao Sato | 2017-05-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9646901 | Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark area | Toshihiko Akiba, Bunji Yasumura, Masanao Sato | 2017-05-09 |