Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9824944 | Semiconductor device | Fumio Tsuchiya, Hisanori Ito, Takuji Ide, Naoki Kawanabe, Masanao Sato | 2017-11-21 |
| 9825017 | Method for manufacturing semiconductor device | Yoshinori Deguchi, Fumikazu Takei, Akio Hasebe, Naohiro Makihira, Mitsuyuki Kubo | 2017-11-21 |
| 9646901 | Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark area | Toshihiko Akiba, Masanao Sato, Hiromi Abe | 2017-05-09 |