| 9831141 |
Integrated circuit containing DOEs of GATE-snake-open-configured, NCEM-enabled fill cells |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Indranil De +20 more |
2017-11-28 |
$5,186,000 |
| 9825018 |
Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including tip-to-tip short configured fill cells, and the second DOE including chamfer short configured fill cells |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Indranil De +20 more |
2017-11-21 |
$4,889,000 |
| 9818738 |
Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells with first DOE including tip-to-side short configured fill cells and second DOE including chamfer short configured fill cells |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Indranil De +20 more |
2017-11-14 |
$2,287,000 |
| 9818660 |
Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including via open configured fill cells, and the second DOE including metal island open configured fill cells |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Indranil De +20 more |
2017-11-14 |
$2,287,000 |
| 9805994 |
Mesh-style NCEM pads, and process for making semiconductor dies, chips, and wafers using in-line measurements from such pads |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Indranil De +20 more |
2017-10-31 |
$4,776,000 |
| 9799640 |
Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including chamfer short configured fill cells, and the second DOE including corner short configured fill cells |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Indranil De +20 more |
2017-10-24 |
$2,195,000 |
| 9799575 |
Integrated circuit containing DOEs of NCEM-enabled fill cells |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Indranil De +20 more |
2017-10-24 |
$2,195,000 |
| 9793253 |
Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least Via-open-configured, AACNT-short-configured, GATE-short-configured, and TS-short-configured NCEM-enabled fill cells |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Indranil De +20 more |
2017-10-17 |
$2,145,000 |
| 9786650 |
Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including snake open configured fill cells, and the second DOE including metal island open configured fill cells |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Indranil De +20 more |
2017-10-10 |
$1,101,000 |
| 9786649 |
Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including via open configured fill cells, and the second DOE including stitch open configured fill cells |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Indranil De +20 more |
2017-10-10 |
$1,101,000 |
| 9786648 |
Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least chamfer-short-configured, AACNT-short-configured, GATECNT-short-configured, and TS-short-configured, NCEM-enabled fill cells |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Indranil De +20 more |
2017-10-10 |
$1,101,000 |
| 9785496 |
Process for making semiconductor dies, chips, and wafers using non-contact measurements obtained from DOEs of NCEM-enabled fill cells on wafers that include multiple steps for enabling NC detecteion of AACNT-TS via opens |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Indranil De +20 more |
2017-10-10 |
$1,101,000 |
| 9778974 |
Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including snake open configured fill cells, and the second DOE including metal island open configured fill cells |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Indranil De +20 more |
2017-10-03 |
$2,177,000 |
| 9780083 |
Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, TS-short-configured, metal-short configured, and AA-short-configured, NCEM-enabled fill cells |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Indranil De +20 more |
2017-10-03 |
$2,177,000 |
| 9773774 |
Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including chamfer short configured fill cells, and the second DOE including corner short configured fill cells |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Indranil De +20 more |
2017-09-26 |
$1,439,000 |
| 9773775 |
Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including merged-via open configured fill cells, and the second DOE including snake open configured fill cells |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Indranil De +20 more |
2017-09-26 |
$1,439,000 |
| 9773773 |
Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least chamfer-short-configured, AACNT-short-configured, GATE-short-configured, and GATECNT-short-configured, NCEM-enabled fill cells |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Indranil De +20 more |
2017-09-26 |
$1,439,000 |
| 9768083 |
Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including merged-via open configured fill cells, and the second DOE including snake open configured fill cells |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Indranil De +20 more |
2017-09-19 |
$1,306,000 |
| 9766970 |
Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including merged-via open configured fill cells, and the second DOE including metal island open configured fill cells |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Indranil De +20 more |
2017-09-19 |
$1,306,000 |
| 9768156 |
Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including side-to-side short configured fill cells, and the second DOE including chamfer short configured fill cells |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Indranil De +20 more |
2017-09-19 |
$1,306,000 |
| 9761575 |
Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least chamfer-short-configured, AACNT-short-configured, GATE-short-configured, and TS-short-configured, NCEM-enabled fill cells |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Indranil De +20 more |
2017-09-12 |
$1,048,000 |
| 9761574 |
Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, GATECNT-short-configured, metal-short-configured, and AA-short-configured, NCEM-enabled fill cells |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Indranil De +20 more |
2017-09-12 |
$1,048,000 |
| 9761573 |
Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, AACNT-short-configured, GATE-short-configured, and TS-short-configured, NCEM-enabled fill cells |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Indranil De +20 more |
2017-09-12 |
$1,048,000 |
| 9761502 |
Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including via open configured fill cells, and the second DOE including merged-via configured fill cells |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Indranil De +20 more |
2017-09-12 |
$1,048,000 |
| 9748153 |
Process for making and using a semiconductor wafer containing first and second does of standard cell compatible, NCEM-enabled fill cells, with the first DOE including side-to-side short configured fill cells, and the second DOE including tip-to-side short configure |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Indranil De +20 more |
2017-08-29 |
$4,221,000 |