Mesh-style NCEM pads, and process for making semiconductor dies, chips, and wafers using in-line measurements from such pads

Assignee

• Pdf Solutions

Inventors

• Stephen Lam (87 patents)
• Dennis Ciplickas (104 patents)
• Tomasz Brozek (90 patents)
• Jeremy Cheng (90 patents)
• Simone Comensoli (82 patents)
• Indranil De (115 patents)
• Kelvin Doong (84 patents)
• Hans Eisenmann (87 patents)
• Timothy Fiscus (97 patents)
• Jonathan Haigh (95 patents)
• Christopher Hess (132 patents)
• John Kibarian (90 patents)
• Sherry Lee (91 patents)
• Marci Liao (83 patents)
• Sheng-Che Lin (87 patents)
• Hideki Matsuhashi (85 patents)
• Kimon Michaels (90 patents)
• Conor O'Sullivan (82 patents)
• Markus Rauscher (82 patents)
• Vyacheslav Rovner (84 patents)
• Andrzej Strojwas (84 patents)
• Marcin Strojwas (82 patents)
• Carl Taylor (82 patents)
• Rakesh Vallishayee (86 patents)
• Larg Weiland (95 patents)
• Nobuharu Yokoyama (82 patents)

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