Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9799636 | Packaged devices with multiple planes of embedded electronic devices | Michael B. Vincent, Scott M. Hayes | 2017-10-24 |
| 9721881 | Apparatus and methods for multi-die packaging | Wei Gao | 2017-08-01 |
| 9673150 | EMI/RFI shielding for semiconductor device packages | Scott M. Hayes, Michael B. Vincent | 2017-06-06 |
| 9607918 | Fan-out wafer level packages containing embedded ground plane interconnect structures and methods for the fabrication thereof | Weng F. Yap | 2017-03-28 |
| 9570387 | Three-dimensional integrated circuit systems in a package and methods therefor | Scott M. Hayes, Michael B. Vincent | 2017-02-14 |
| 9548280 | Solder pad for semiconductor device package | Vijay Sarihan, Scott M. Hayes | 2017-01-17 |