Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818712 | Package with low stress region for an electronic component | Paige M. Holm | 2017-11-14 |
| 9548280 | Solder pad for semiconductor device package | Zhiwei Gong, Scott M. Hayes | 2017-01-17 |