Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9799636 | Packaged devices with multiple planes of embedded electronic devices | Michael B. Vincent, Zhiwei Gong | 2017-10-24 |
| 9761565 | Microelectronic packages having embedded sidewall substrates and methods for the producing thereof | Michael B. Vincent | 2017-09-12 |
| 9673150 | EMI/RFI shielding for semiconductor device packages | Zhiwei Gong, Michael B. Vincent | 2017-06-06 |
| 9673162 | High power semiconductor package subsystems | Lakshminarayan Viswanathan, Scott D. Marshall, Mahesh K. Shah | 2017-06-06 |
| 9595485 | Microelectronic packages having embedded sidewall substrates and methods for the producing thereof | Michael B. Vincent | 2017-03-14 |
| 9570387 | Three-dimensional integrated circuit systems in a package and methods therefor | Zhiwei Gong, Michael B. Vincent | 2017-02-14 |
| 9548280 | Solder pad for semiconductor device package | Vijay Sarihan, Zhiwei Gong | 2017-01-17 |