Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786515 | Semiconductor device package and methods of manufacture thereof | — | 2017-10-10 |
| 9780077 | System-in-packages containing preassembled surface mount device modules and methods for the production thereof | — | 2017-10-03 |
| 9761569 | Leadframe-based system-in-packages having sidewall-mounted surface mount devices and methods for the production thereof | — | 2017-09-12 |
| 9698104 | Integrated electronic package and stacked assembly thereof | Michael B. Vincent | 2017-07-04 |
| 9607918 | Fan-out wafer level packages containing embedded ground plane interconnect structures and methods for the fabrication thereof | Zhiwei Gong | 2017-03-28 |
| 9595509 | Stacked microelectronic package assemblies and methods for the fabrication thereof | — | 2017-03-14 |
| 9589909 | Radio frequency and electromagnetic interference shielding in wafer level packaging using redistribution layers | Eduard Jan Pabst | 2017-03-07 |