Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9589909 | Radio frequency and electromagnetic interference shielding in wafer level packaging using redistribution layers | Weng F. Yap | 2017-03-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9589909 | Radio frequency and electromagnetic interference shielding in wafer level packaging using redistribution layers | Weng F. Yap | 2017-03-07 |