Issued Patents 2017
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748137 | Method for void-free cobalt gap fill | Chiukin Steven Lai, Jeong-Seok Na, Raihan M. Tarafdar, Michal Danek | 2017-08-29 |
| 9673146 | Low temperature tungsten film deposition for small critical dimension contacts and interconnects | Feng Chen, Michal Danek, Anand Chandrashekar | 2017-06-06 |
| 9653353 | Tungsten feature fill | Anand Chandrashekar, Esther Jeng, Michal Danek, Juwen Gao, Deqi Wang | 2017-05-16 |
| 9613818 | Deposition of low fluorine tungsten by sequential CVD process | Xiaolan Ba, Michal Danek, Lawrence Schloss | 2017-04-04 |
| 9595470 | Methods of preparing tungsten and tungsten nitride thin films using tungsten chloride precursor | Hanna Bamnolker, Juwen Gao, Michal Danek, Joshua Collins | 2017-03-14 |
| 9589835 | Method for forming tungsten film having low resistivity, low roughness and high reflectivity | Anand Chandrashekar | 2017-03-07 |
| 9589808 | Method for depositing extremely low resistivity tungsten | Hanna Bamnolker, Deqi Wang, Yan Guan | 2017-03-07 |
| 9548228 | Void free tungsten fill in different sized features | Anand Chandrashekar | 2017-01-17 |