Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812421 | Bonding wire for semiconductor devices | Yoshiaki Hagiwara, Tetsuya OYAMADA, Daizo Oda | 2017-11-07 |
| 9773748 | Bonding wire for semiconductor device | Takashi Yamada, Daizo Oda, Ryo OISHI | 2017-09-26 |
| 9543266 | Bonding wire for semiconductor device use and method of production of same | Takashi Yamada, Daizo Oda, Ryo OISHI, Teruo Haibara | 2017-01-10 |
| 9536854 | Bonding wire for semiconductor device use and method of production of same | Takashi Yamada, Daizo Oda, Ryo OISHI, Teruo Haibara | 2017-01-03 |