TO

Tetsuya OYAMADA

NM Nippon Micrometal: 1 patents #6 of 7Top 90%
NC Nippon Steel & Sumikin Materials Co.: 1 patents #6 of 22Top 30%
Overall (2017): #221,287 of 506,227Top 45%
1
Patents 2017

Issued Patents 2017

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9812421 Bonding wire for semiconductor devices Tomohiro Uno, Yoshiaki Hagiwara, Daizo Oda 2017-11-07