Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9773748 | Bonding wire for semiconductor device | Takashi Yamada, Daizo Oda, Tomohiro Uno | 2017-09-26 |
| 9543266 | Bonding wire for semiconductor device use and method of production of same | Takashi Yamada, Daizo Oda, Teruo Haibara, Tomohiro Uno | 2017-01-10 |
| 9536854 | Bonding wire for semiconductor device use and method of production of same | Takashi Yamada, Daizo Oda, Teruo Haibara, Tomohiro Uno | 2017-01-03 |