TY

Takashi Yamada

NM Nippon Micrometal: 3 patents #3 of 7Top 45%
NC Nippon Steel & Sumikin Materials Co.: 3 patents #3 of 22Top 15%
LC Lapis Semiconductor Co.: 1 patents #19 of 62Top 35%
MC Murata Manufacturing Co.: 1 patents #252 of 596Top 45%
OC Omron Automotive Electronics Co.: 1 patents #12 of 49Top 25%
RI Rigaku: 1 patents #3 of 26Top 15%
SO Sony: 1 patents #1,281 of 3,100Top 45%
KA Kao: 1 patents #25 of 178Top 15%
TO Toyota: 1 patents #1,214 of 3,557Top 35%
Kyocera: 1 patents #160 of 506Top 35%
Overall (2017): #5,447 of 506,227Top 2%
11
Patents 2017

Issued Patents 2017

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
9829998 Information processing apparatus, input apparatus, information processing system, information processing method, and program Hideaki Kumagai, Katsuhiko Yamada, Kazuyuki Yamamoto, Hidetoshi Kabasawa, Toshio Mamiya 2017-11-28
9815610 Squeeze container Yoshinori Inagawa 2017-11-14
9798408 Electronic device Yumiko Kashiwa, Yasushi Sasaki, Makoto Chishima 2017-10-24
9773748 Bonding wire for semiconductor device Daizo Oda, Ryo OISHI, Tomohiro Uno 2017-09-26
9768729 Power amplifier Kazuma Sugiura, Norio Hayashi, Satoshi Tanaka, Kenichi Shimamoto, Kazuo Watanabe 2017-09-19
9755644 Interface circuit 2017-09-05
9746433 X-ray fluorescence spectrometer and X-ray fluorescence analyzing method Yuichiro Shimizu 2017-08-29
9660283 Current measurement device Yuji Ishikawa, Ikuyasu Kato, Takashi Yamamoto, Keigo Suematsu 2017-05-23
9642242 Power conversion apparatus Yusaku Ido, Akihiro Fujiwara 2017-05-02
9543266 Bonding wire for semiconductor device use and method of production of same Daizo Oda, Ryo OISHI, Teruo Haibara, Tomohiro Uno 2017-01-10
9536854 Bonding wire for semiconductor device use and method of production of same Daizo Oda, Ryo OISHI, Teruo Haibara, Tomohiro Uno 2017-01-03