| 9809450 |
CMOS-MEMS integration using metal silicide formation |
Jong Il Shin, Jongwoo Shin |
2017-11-07 |
| 9796580 |
CMOS-MEMS-CMOS platform |
Martin Lim |
2017-10-24 |
| 9761557 |
CMOS-MEMS integration by sequential bonding method |
Jong Il Shin, Jongwoo Shin |
2017-09-12 |
| 9754922 |
3D integration using Al—Ge eutectic bond interconnect |
Mozafar Maghsoudnia |
2017-09-05 |
| 9738512 |
CMOS-MEMS integrated device including multiple cavities at different controlled pressures and methods of manufacture |
Daesung Lee, Jongwoo Shin, Jong Il Shin, Martin Lim |
2017-08-22 |
| 9725305 |
Dual cavity pressure structures |
Jong Il Shin, Daesung Lee |
2017-08-08 |
| 9718680 |
CMOS-MEMS integrated device including a contact layer and methods of manufacture |
Daesung Lee, Jongwoo Shin, Jong Il Shin |
2017-08-01 |
| 9698252 |
Variable gate width FinFET |
Mayank Gupta |
2017-07-04 |
| 9611137 |
MEMS sensor integrated with a flip chip |
Mozafar Maghsoudnia |
2017-04-04 |
| 9540228 |
MEMS-CMOS device that minimizes outgassing and methods of manufacture |
Jong Il Shin, Jongwoo Shin |
2017-01-10 |