Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9809450 | CMOS-MEMS integration using metal silicide formation | Peter Smeys, Jongwoo Shin | 2017-11-07 |
| 9761557 | CMOS-MEMS integration by sequential bonding method | Peter Smeys, Jongwoo Shin | 2017-09-12 |
| 9738512 | CMOS-MEMS integrated device including multiple cavities at different controlled pressures and methods of manufacture | Daesung Lee, Jongwoo Shin, Peter Smeys, Martin Lim | 2017-08-22 |
| 9725305 | Dual cavity pressure structures | Peter Smeys, Daesung Lee | 2017-08-08 |
| 9718680 | CMOS-MEMS integrated device including a contact layer and methods of manufacture | Daesung Lee, Jongwoo Shin, Peter Smeys | 2017-08-01 |
| 9611133 | Film induced interface roughening and method of producing the same | Fang Liu, Martin Lim, Jongwoo Shin | 2017-04-04 |
| 9540228 | MEMS-CMOS device that minimizes outgassing and methods of manufacture | Peter Smeys, Jongwoo Shin | 2017-01-10 |