Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754922 | 3D integration using Al—Ge eutectic bond interconnect | Peter Smeys | 2017-09-05 |
| 9611137 | MEMS sensor integrated with a flip chip | Peter Smeys | 2017-04-04 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754922 | 3D integration using Al—Ge eutectic bond interconnect | Peter Smeys | 2017-09-05 |
| 9611137 | MEMS sensor integrated with a flip chip | Peter Smeys | 2017-04-04 |