Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9722137 | LED having vertical contacts redistributed for flip chip mounting | Jipu Lei, Kwong-Hin Henry Choy, Yajun Wei, Stefano Schiaffino | 2017-08-01 |
| 9722161 | P-n separation metal fill for flip chip LEDs | Jipu Lei, Yajun Wei, Alexander H. Nickel, Stefano Schiaffino | 2017-08-01 |
| 9705047 | Method of attaching a light emitting device to a support substrate | Jerome Chandra Bhat, Salman Akram | 2017-07-11 |