Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9722137 | LED having vertical contacts redistributed for flip chip mounting | Jipu Lei, Kwong-Hin Henry Choy, Yajun Wei, Daniel A. Steigerwald | 2017-08-01 |
| 9722161 | P-n separation metal fill for flip chip LEDs | Jipu Lei, Yajun Wei, Alexander H. Nickel, Daniel A. Steigerwald | 2017-08-01 |
| 9687848 | Microfluidic system with fluid pickups | Anthony Makarewicz, Luc Bousse | 2017-06-27 |
| 9660164 | Light emitting device with reduced epi stress | Frederic Stephane Diana, Yajun Wei, Brendan Jude Moran | 2017-05-23 |
| 9608016 | Method of separating a wafer of semiconductor devices | Jipu Lei, Alexander H. Nickel, Grigoriy Basin | 2017-03-28 |