Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9722137 | LED having vertical contacts redistributed for flip chip mounting | Kwong-Hin Henry Choy, Yajun Wei, Stefano Schiaffino, Daniel A. Steigerwald | 2017-08-01 |
| 9722161 | P-n separation metal fill for flip chip LEDs | Yajun Wei, Alexander H. Nickel, Stefano Schiaffino, Daniel A. Steigerwald | 2017-08-01 |
| 9608016 | Method of separating a wafer of semiconductor devices | Alexander H. Nickel, Stefano Schiaffino, Grigoriy Basin | 2017-03-28 |