Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9722161 | P-n separation metal fill for flip chip LEDs | Jipu Lei, Yajun Wei, Stefano Schiaffino, Daniel A. Steigerwald | 2017-08-01 |
| 9608016 | Method of separating a wafer of semiconductor devices | Jipu Lei, Stefano Schiaffino, Grigoriy Basin | 2017-03-28 |