Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9589853 | Method of planarizing an upper surface of a semiconductor substrate in a plasma etch chamber | Monica Titus, Gowri Kamarthy, Harmeet Singh, Yoshie Kimura, Meihua Shen +2 more | 2017-03-07 |
| 9570320 | Method to etch copper barrier film | Meihua Shen, Ji Zhu, Shuogang Huang, Baosuo Zhou, Prithu Sharma +1 more | 2017-02-14 |