Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9780017 | Packaged device with additive substrate surface modification | Benjamin Stassen Cook, Juan Alejandro Herbsommer, Rongwei Zhang, Abram Castro, Matthew David Romig | 2017-10-03 |
| 9780060 | Packaged IC with solderable sidewalls | Vikas Gupta, Rongwei Zhang | 2017-10-03 |