Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9666549 | Methods for solder for through-mold interconnect | Chia-Pin Chiu, Linda Zhang, Robert M. Nickerson, Charles A. Gealer | 2017-05-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9666549 | Methods for solder for through-mold interconnect | Chia-Pin Chiu, Linda Zhang, Robert M. Nickerson, Charles A. Gealer | 2017-05-30 |