Issued Patents 2017
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9826630 | Fan-out wafer level packages having preformed embedded ground plane connections and methods for the fabrication thereof | — | 2017-11-21 |
| 9799636 | Packaged devices with multiple planes of embedded electronic devices | Zhiwei Gong, Scott M. Hayes | 2017-10-24 |
| 9761565 | Microelectronic packages having embedded sidewall substrates and methods for the producing thereof | Scott M. Hayes | 2017-09-12 |
| 9761570 | Electronic component package with multple electronic components | Jason Wright | 2017-09-12 |
| 9698104 | Integrated electronic package and stacked assembly thereof | Weng F. Yap | 2017-07-04 |
| 9673150 | EMI/RFI shielding for semiconductor device packages | Zhiwei Gong, Scott M. Hayes | 2017-06-06 |
| 9595485 | Microelectronic packages having embedded sidewall substrates and methods for the producing thereof | Scott M. Hayes | 2017-03-14 |
| 9570387 | Three-dimensional integrated circuit systems in a package and methods therefor | Zhiwei Gong, Scott M. Hayes | 2017-02-14 |