Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9601475 | Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips | Thorsten Meyer, Stephan Bradl, Ralf Plieninger, Jens Pohl, Klaus Pressel +1 more | 2017-03-21 |
| 9570352 | Method of dicing a wafer and semiconductor chip | Bernhard Drummer, Korbinian Kaspar, Gunther Mackh | 2017-02-14 |